this appears to be the languge that was proposed for the 2002 NEC.
Looks like we are reverting to the language that was in the previous code.
Revise Section 250.104(B) of the 2002 NEC ROP draft to read as
follows:
(B) Other Metal Piping. Where installed in or attached to a
building or structure, metal piping system(s), including gas piping,
that may become energized shall be bonded to the service
equipment enclosure, the grounded conductor at the service, the
grounding electrode conductor where of sufficient size, or to the
one or more grounding electrodes used. The bonding jumper(s)
shall be sized in accordance with 250.122 using the rating of the
circuit that may energize the piping system(s). The equipment
grounding conductor for the circuit that may energize the piping
shall be permitted to serve as the bonding means. The points of
attachment of the bonding jumper(s) shall be accessible.
FPN: Bonding all piping and metal air ducts within the premises
will provide additional safety.
