how a fault would travel vs. the impedance of the RMC
(or any wirerun method) comes to mind here.
so some studies as Pierre alludes may be enlightening...
Question 3: Could we live with a term to read as follows" "... Equipment grounding and bonding conductor"?
the two terms can exist soley without the other right? (EGC or BC) so to say EC&BC might end up a terminology stumbling block in the nec
~S~