how a fault would travel vs. the impedance of the RMC (or any wirerun method) comes to mind here.

so some studies as Pierre alludes may be enlightening...

Quote
Question 3: Could we live with a term to read as follows" "... Equipment grounding and bonding conductor"?

the two terms can exist soley without the other right? (EGC or BC) so to say EC&BC might end up a terminology stumbling block in the nec

~S~